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Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
518-77-360M19-001106 CONN SOCKET PGA 360POS GOLD Preci-Dip	2,788	44.70	- + Add To Cart Inquiry Now	Datasheet	Bulk	518	Active	PGA	360 (19 x 19)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.050 (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass
64-9503-21 CONN IC DIP SOCKET 64POS GOLD Aries Electronics	3,087	47.70	- + Add To Cart Inquiry Now	Datasheet	Bulk	503	Active	DIP, 0.9 (22.86mm) Row Spacing	64 (2 x 32)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
64-9503-31 CONN IC DIP SOCKET 64POS GOLD Aries Electronics	3,072	47.70	- + Add To Cart Inquiry Now	Datasheet	Bulk	503	Active	DIP, 0.9 (22.86mm) Row Spacing	64 (2 x 32)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
546-83-447-20-121147 CONN SOCKET PGA 447POS GOLD Preci-Dip	2,100	46.10	- + Add To Cart Inquiry Now	Datasheet	Bulk	546	Active	PGA	447 (20 x 20)	0.050 (1.27mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100 (2.54mm)	Tin	-	Bronze	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
32-6556-41 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	3,284	47.98	- + Add To Cart Inquiry Now	Datasheet	Bulk	6556	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder Cup	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled
514-83-420M26-001148 CONN SOCKET BGA 420POS GOLD Preci-Dip	2,120	46.05	- + Add To Cart Inquiry Now	Datasheet	Bulk	514	Active	BGA	420 (26 x 26)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-420M26-001152 BGA SOLDER TAIL Preci-Dip	2,749	46.44	- + Add To Cart Inquiry Now	Datasheet	Bulk	550	Active	BGA	420 (26 x 26)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
36-6556-40 CONN IC DIP SOCKET 36POS GOLD Aries Electronics	3,384	48.52	- + Add To Cart Inquiry Now	Datasheet	Bulk	6556	Active	DIP, 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder Cup	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled
614-83-325-18-111144 CONN SOCKET PGA 325POS GOLD Preci-Dip	2,673	46.63	- + Add To Cart Inquiry Now	Datasheet	Bulk	614	Active	PGA	325 (18 x 18)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
558-10-400M20-000101 PGA SOLDER TAIL 1.27MM Preci-Dip	3,214	45.73	- + Add To Cart Inquiry Now	Datasheet	Bulk	558	Active	PGA	400 (20 x 20)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
36-3570-16 CONN IC DIP SOCKET ZIF 36POS Aries Electronics	2,052	48.83	- + Add To Cart Inquiry Now	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyphenylene Sulfide (PPS), Glass Filled
36-3571-16 CONN IC DIP SOCKET ZIF 36POS Aries Electronics	2,618	48.83	- + Add To Cart Inquiry Now	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyphenylene Sulfide (PPS), Glass Filled
36-3572-16 CONN IC DIP SOCKET ZIF 36POS Aries Electronics	2,932	48.83	- + Add To Cart Inquiry Now	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyphenylene Sulfide (PPS), Glass Filled
36-3573-16 CONN IC DIP SOCKET ZIF 36POS Aries Electronics	2,807	48.83	- + Add To Cart Inquiry Now	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyphenylene Sulfide (PPS), Glass Filled
36-3574-16 CONN IC DIP SOCKET ZIF 36POS TIN Aries Electronics	3,238	48.83	- + Add To Cart Inquiry Now	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
36-3575-16 CONN IC DIP SOCKET ZIF 36POS TIN Aries Electronics	3,768	48.83	- + Add To Cart Inquiry Now	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
36-6571-16 CONN IC DIP SOCKET ZIF 36POS Aries Electronics	3,126	48.83	- + Add To Cart Inquiry Now	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyphenylene Sulfide (PPS), Glass Filled
36-6573-16 CONN IC DIP SOCKET ZIF 36POS TIN Aries Electronics	2,326	48.83	- + Add To Cart Inquiry Now	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
36-6574-16 CONN IC DIP SOCKET ZIF 36POS TIN Aries Electronics	2,254	48.83	- + Add To Cart Inquiry Now	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
36-6575-16 CONN IC DIP SOCKET ZIF 36POS TIN Aries Electronics	2,290	48.83	- + Add To Cart Inquiry Now	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled

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