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Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
510-13-088-13-081002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3,760	33.23	- + Add To Cart Inquiry Now	Datasheet	Bulk	510	Active	PGA	88 (13 x 13)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-088-13-081003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3,210	33.23	- + Add To Cart Inquiry Now	Datasheet	Bulk	510	Active	PGA	88 (13 x 13)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-088-13-062001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2,771	33.23	- + Add To Cart Inquiry Now	Datasheet	Bulk	510	Active	PGA	88 (13 x 13)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-088-13-081001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2,224	33.23	- + Add To Cart Inquiry Now	Datasheet	Bulk	510	Active	PGA	88 (13 x 13)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
518-77-256M16-000105 CONN SOCKET PGA 256POS GOLD Preci-Dip	2,807	31.21	- + Add To Cart Inquiry Now	Datasheet	Bulk	518	Active	PGA	256 (16 x 16)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050 (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass
518-77-256M20-001105 CONN SOCKET PGA 256POS GOLD Preci-Dip	3,364	31.93	- + Add To Cart Inquiry Now	Datasheet	Bulk	518	Active	PGA	256 (20 x 20)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.050 (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass
APA-648-G-N ADAPTER PLUG Samtec Inc.	2,397	33.29	- + Add To Cart Inquiry Now		Tube	APA	Active	-	48 (2 x 24)	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
510-91-196-14-000002 SOCKET SOLDERTAIL 196-PGA Mill-Max Manufacturing Corp.	3,895	33.30	- + Add To Cart Inquiry Now		Bulk	510	Active	PGA	196 (14 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-196-14-000001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2,284	33.30	- + Add To Cart Inquiry Now	Datasheet	Bulk	510	Active	PGA	196 (14 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-196-14-000003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3,736	33.30	- + Add To Cart Inquiry Now	Datasheet	Bulk	510	Active	PGA	196 (14 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
40-6574-11 CONN IC DIP SOCKET ZIF 40POS TIN Aries Electronics	3,829	33.33	- + Add To Cart Inquiry Now	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
40-3574-11 CONN IC DIP SOCKET ZIF 40POS GLD Aries Electronics	3,935	33.33	- + Add To Cart Inquiry Now	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
40-6573-11 CONN IC DIP SOCKET ZIF 40POS TIN Aries Electronics	2,187	33.33	- + Add To Cart Inquiry Now	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
40-3570-11 CONN IC DIP SOCKET ZIF 40POS GLD Aries Electronics	3,133	33.33	- + Add To Cart Inquiry Now	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
40-3571-11 CONN IC DIP SOCKET ZIF 40POS GLD Aries Electronics	3,102	33.33	- + Add To Cart Inquiry Now	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
40-3572-11 CONN IC DIP SOCKET ZIF 40POS GLD Aries Electronics	2,110	33.33	- + Add To Cart Inquiry Now	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
40-3573-11 CONN IC DIP SOCKET ZIF 40POS GLD Aries Electronics	3,243	33.33	- + Add To Cart Inquiry Now	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
40-3575-11 CONN IC DIP SOCKET ZIF 40POS GLD Aries Electronics	3,888	33.33	- + Add To Cart Inquiry Now	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
40-6570-11 CONN IC DIP SOCKET ZIF 40POS GLD Aries Electronics	3,709	33.33	- + Add To Cart Inquiry Now	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
40-6571-11 CONN IC DIP SOCKET ZIF 40POS GLD Aries Electronics	2,883	33.33	- + Add To Cart Inquiry Now	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled

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