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Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
40-8300-310C CONN IC DIP SOCKET 40POS GOLD Aries Electronics	3,118	25.28	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
40-8320-610C CONN IC DIP SOCKET 40POS GOLD Aries Electronics	2,706	25.28	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
40-8350-610C CONN IC DIP SOCKET 40POS GOLD Aries Electronics	2,177	25.28	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
40-8370-610C CONN IC DIP SOCKET 40POS GOLD Aries Electronics	2,766	25.28	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
40-8435-310C CONN IC DIP SOCKET 40POS GOLD Aries Electronics	3,300	25.28	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
40-8460-610C CONN IC DIP SOCKET 40POS GOLD Aries Electronics	2,200	25.28	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
40-8500-610C CONN IC DIP SOCKET 40POS GOLD Aries Electronics	3,103	25.28	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
40-8530-610C CONN IC DIP SOCKET 40POS GOLD Aries Electronics	2,913	25.28	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
40-8600-610C CONN IC DIP SOCKET 40POS GOLD Aries Electronics	3,258	25.28	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
40-8620-610C CONN IC DIP SOCKET 40POS GOLD Aries Electronics	3,549	25.28	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
40-8625-610C CONN IC DIP SOCKET 40POS GOLD Aries Electronics	3,970	25.28	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
40-8650-610C CONN IC DIP SOCKET 40POS GOLD Aries Electronics	3,205	25.28	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
40-8700-310C CONN IC DIP SOCKET 40POS GOLD Aries Electronics	2,114	25.28	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
40-8700-610C CONN IC DIP SOCKET 40POS GOLD Aries Electronics	2,957	25.28	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
40-8750-610C CONN IC DIP SOCKET 40POS GOLD Aries Electronics	2,444	25.28	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
40-8770-610C CONN IC DIP SOCKET 40POS GOLD Aries Electronics	3,346	25.28	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
40-8785-310C CONN IC DIP SOCKET 40POS GOLD Aries Electronics	3,399	25.28	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
40-8785-610C CONN IC DIP SOCKET 40POS GOLD Aries Electronics	2,957	25.28	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
40-8800-610C CONN IC DIP SOCKET 40POS GOLD Aries Electronics	2,588	25.28	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
40-8810-610C CONN IC DIP SOCKET 40POS GOLD Aries Electronics	2,067	25.28	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled

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