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Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
126-41-648-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,886	20.86	- + Add To Cart Inquiry Now	Datasheet	Tube	126	Active	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-648-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,396	20.86	- + Add To Cart Inquiry Now	Datasheet	Tube	126	Active	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
28-0501-21 CONN SOCKET SIP 28POS GOLD Aries Electronics	3,321	20.87	- + Add To Cart Inquiry Now	Datasheet	Bulk	501	Active	SIP	28 (1 x 28)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
28-0501-31 CONN SOCKET SIP 28POS GOLD Aries Electronics	2,416	20.87	- + Add To Cart Inquiry Now	Datasheet	Bulk	501	Active	SIP	28 (1 x 28)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
37-0501-20 CONN SOCKET SIP 37POS TIN Aries Electronics	2,119	20.87	- + Add To Cart Inquiry Now	Datasheet	Bulk	501	Active	SIP	37 (1 x 37)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
37-0501-30 CONN SOCKET SIP 37POS TIN Aries Electronics	3,346	20.87	- + Add To Cart Inquiry Now	Datasheet	Bulk	501	Active	SIP	37 (1 x 37)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
16-3508-21 CONN IC DIP SOCKET 16POS GOLD Aries Electronics	2,374	20.87	- + Add To Cart Inquiry Now	Datasheet	Bulk	508	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
16-3508-31 CONN IC DIP SOCKET 16POS GOLD Aries Electronics	3,830	20.87	- + Add To Cart Inquiry Now	Datasheet	Bulk	508	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
612-43-650-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	2,027	20.89	- + Add To Cart Inquiry Now	Datasheet	Tube	612	Active	DIP, 0.6 (15.24mm) Row Spacing	50 (2 x 25)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-650-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	2,647	20.89	- + Add To Cart Inquiry Now	Datasheet	Tube	612	Active	DIP, 0.6 (15.24mm) Row Spacing	50 (2 x 25)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
25-0508-21 CONN SOCKET SIP 25POS GOLD Aries Electronics	3,155	20.89	- + Add To Cart Inquiry Now	Datasheet	Bulk	508	Active	SIP	25 (1 x 25)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6
25-0508-31 CONN SOCKET SIP 25POS GOLD Aries Electronics	3,832	20.89	- + Add To Cart Inquiry Now	Datasheet	Bulk	508	Active	SIP	25 (1 x 25)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6
40-6820-90C CONN IC DIP SOCKET 40POS GOLD Aries Electronics	3,695	20.89	- + Add To Cart Inquiry Now	Datasheet	Bulk	Vertisockets™ 800	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
40-6822-90C CONN IC DIP SOCKET 40POS GOLD Aries Electronics	2,979	20.89	- + Add To Cart Inquiry Now	Datasheet	Bulk	Vertisockets™ 800	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
40-6823-90C CONN IC DIP SOCKET 40POS GOLD Aries Electronics	3,812	20.89	- + Add To Cart Inquiry Now	Datasheet	Bulk	Vertisockets™ 800	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
115-44-424-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2,124	20.89	- + Add To Cart Inquiry Now		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
612-11-950-41-001000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	3,182	20.90	- + Add To Cart Inquiry Now	Datasheet	Tube	612	Active	DIP, 0.9 (22.86mm) Row Spacing	50 (2 x 25)	0.100 (2.54mm)	-	-	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
42-6554-10 CONN IC DIP SOCKET ZIF 42POS TIN Aries Electronics	3,540	20.91	- + Add To Cart Inquiry Now	Datasheet	Tray	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
42-3551-10 CONN IC DIP SOCKET ZIF 42POS TIN Aries Electronics	2,152	20.91	- + Add To Cart Inquiry Now	Datasheet	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
42-3552-10 CONN IC DIP SOCKET ZIF 42POS TIN Aries Electronics	2,140	20.91	- + Add To Cart Inquiry Now	Datasheet	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled

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