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Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
25-7700-10 CONN SOCKET SIP 25POS TIN Aries Electronics	3,834	16.18	- + Add To Cart Inquiry Now	Datasheet	Bulk	700 Elevator Strip-Line™	Active	SIP	25 (1 x 25)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
25-7750-10 CONN SOCKET SIP 25POS TIN Aries Electronics	2,070	16.18	- + Add To Cart Inquiry Now	Datasheet	Bulk	700 Elevator Strip-Line™	Active	SIP	25 (1 x 25)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
25-7770-10 CONN SOCKET SIP 25POS TIN Aries Electronics	2,846	16.18	- + Add To Cart Inquiry Now	Datasheet	Bulk	700 Elevator Strip-Line™	Active	SIP	25 (1 x 25)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
25-7787-10 CONN SOCKET SIP 25POS TIN Aries Electronics	2,021	16.18	- + Add To Cart Inquiry Now	Datasheet	Bulk	700 Elevator Strip-Line™	Active	SIP	25 (1 x 25)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
25-7800-10 CONN SOCKET SIP 25POS TIN Aries Electronics	3,569	16.18	- + Add To Cart Inquiry Now	Datasheet	Bulk	700 Elevator Strip-Line™	Active	SIP	25 (1 x 25)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
25-7846-10 CONN SOCKET SIP 25POS TIN Aries Electronics	3,780	16.18	- + Add To Cart Inquiry Now	Datasheet	Bulk	700 Elevator Strip-Line™	Active	SIP	25 (1 x 25)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
25-7950-10 CONN SOCKET SIP 25POS TIN Aries Electronics	2,193	16.18	- + Add To Cart Inquiry Now	Datasheet	Bulk	700 Elevator Strip-Line™	Active	SIP	25 (1 x 25)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
110-13-652-41-001000 CONN IC DIP SOCKET 52POS GOLD Mill-Max Manufacturing Corp.	3,627	16.19	- + Add To Cart Inquiry Now	Datasheet	Tube	110	Active	DIP, 0.6 (15.24mm) Row Spacing	52 (2 x 26)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-648-T-N ADAPTER PLUG Samtec Inc.	3,557	16.19	- + Add To Cart Inquiry Now		Tube	APA	Active	-	48 (2 x 24)	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
115-93-650-41-001000 CONN IC DIP SOCKET 50POS GOLD Mill-Max Manufacturing Corp.	2,901	16.20	- + Add To Cart Inquiry Now	Datasheet	Tube	115	Active	DIP, 0.6 (15.24mm) Row Spacing	50 (2 x 25)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-650-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,834	16.20	- + Add To Cart Inquiry Now	Datasheet	Tube	115	Active	DIP, 0.6 (15.24mm) Row Spacing	50 (2 x 25)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-324-41-003000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	2,469	16.20	- + Add To Cart Inquiry Now	Datasheet	Tube	126	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-424-41-003000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	2,840	16.20	- + Add To Cart Inquiry Now	Datasheet	Tube	126	Active	DIP, 0.4 (10.16mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-624-41-003000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	2,796	16.20	- + Add To Cart Inquiry Now	Datasheet	Tube	126	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-324-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,457	16.20	- + Add To Cart Inquiry Now	Datasheet	Tube	126	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-424-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2,899	16.20	- + Add To Cart Inquiry Now	Datasheet	Tube	126	Active	DIP, 0.4 (10.16mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-624-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2,125	16.20	- + Add To Cart Inquiry Now	Datasheet	Tube	126	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-3503-20 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	3,928	16.20	- + Add To Cart Inquiry Now	Datasheet	Bulk	503	Active	DIP, 0.3 (7.62mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
32-3503-30 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	3,265	16.20	- + Add To Cart Inquiry Now	Datasheet	Bulk	503	Active	DIP, 0.3 (7.62mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
32-3551-10 CONN IC DIP SOCKET ZIF 32POS TIN Aries Electronics	2,539	16.21	- + Add To Cart Inquiry Now	Datasheet	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled

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