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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
14-0508-20

14-0508-20

CONN SOCKET SIP 14POS GOLD

Aries Electronics

3,856 6.83
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14-0508-20

Datasheet

Bulk 508 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
14-0508-30

14-0508-30

CONN SOCKET SIP 14POS GOLD

Aries Electronics

2,857 6.83
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14-0508-30

Datasheet

Bulk 508 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
14-1508-20

14-1508-20

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2,716 6.83
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14-1508-20

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
14-1508-30

14-1508-30

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3,008 6.83
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14-1508-30

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
714-43-222-31-018000

714-43-222-31-018000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

2,894 6.83
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714-43-222-31-018000

Datasheet

Bulk 714 Active DIP, 0.1 (2.54mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-628-T-A

APA-628-T-A

ADAPTER PLUG

Samtec Inc.

3,446 6.83
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Bulk APA Active - 28 (2 x 14) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
116-87-432-41-013101

116-87-432-41-013101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2,546 6.44
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116-87-432-41-013101

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
XR2A-4001-N

XR2A-4001-N

CONN IC DIP SOCKET 40POS GOLD

Omron Electronics Inc-EMC Div

2,391 6.85
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XR2A-4001-N

Datasheet

Bulk XR2 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
10-2511-11

10-2511-11

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,318 6.85
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10-2511-11

Datasheet

Bulk 511 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-6513-10H

16-6513-10H

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,418 6.85
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16-6513-10H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-6513-11H

16-6513-11H

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,135 6.85
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16-6513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
39-0518-11

39-0518-11

CONN SOCKET SIP 39POS GOLD

Aries Electronics

2,422 6.85
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39-0518-11

Datasheet

Bulk 518 Active SIP 39 (1 x 39) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-3518-111

20-3518-111

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,706 6.85
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20-3518-111

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-0511-10

10-0511-10

CONN SOCKET SIP 10POS TIN

Aries Electronics

2,264 6.85
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10-0511-10

Datasheet

Bulk 511 Active SIP 10 (1 x 10) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
510-87-221-18-091101

510-87-221-18-091101

CONN SOCKET PGA 221POS GOLD

Preci-Dip

3,202 6.47
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510-87-221-18-091101

Datasheet

Bulk 510 Active PGA 221 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
08-2501-21

08-2501-21

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,219 6.95
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08-2501-21

Datasheet

Bulk 501 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
08-2501-31

08-2501-31

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,488 6.95
- +

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08-2501-31

Datasheet

Bulk 501 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
510-87-225-18-091101

510-87-225-18-091101

CONN SOCKET PGA 225POS GOLD

Preci-Dip

2,783 6.59
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510-87-225-18-091101

Datasheet

Bulk 510 Active PGA 225 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
08-0501-21

08-0501-21

CONN SOCKET SIP 8POS GOLD

Aries Electronics

2,451 6.98
- +

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08-0501-21

Datasheet

Bulk 501 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
115-47-304-41-001000

115-47-304-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

3,908 6.87
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115-47-304-41-001000

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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